Define the assembly profile
Summarise board dimensions, layer count, component technologies, smallest packages, special processes and expected volumes. Prototype responsiveness and stable volume production should be evaluated independently.
Review production and inspection fit
Equipment names matter only when connected to the product. Ask about stencil control, placement range, reflow profiling, through-hole processes, rework and how inspection is selected for hidden or high-risk joints.
- SMT and through-hole range
- AOI and X-ray use
- Moisture and ESD control
- Rework authorisation
Clarify component responsibility
Agree who sources each item, which channels are acceptable, how alternates are approved and what traceability is retained. Consigned, turnkey and mixed models need different controls.
Design the test handoff
State whether programming, in-circuit test, functional test, calibration or box build is required. Test fixtures, software ownership, limits and failure records should be part of the production definition.