ACM Research, Inc.
Wafer fabrication equipment for IC, compound semiconductor and advanced packaging.
Overview
ACM Research, Inc. It develops, manufactures and sells production equipment and provides service solutions for single-wafer and batch wet cleaning, electroplating, stress-free polishing, PECVD, track and thermal processes.
The tools serve IC and compound semiconductor manufacturing, wafer-level packaging, panel-level packaging, and wafer manufacturing and reclaim, for wafer sizes up to 12 inches. Proprietary process technologies include SAPS and TEBO megasonic cleaning.
Product development, manufacturing and support are provided through subsidiaries in Shanghai, China and Korea. The sales and service organisation supports customers in Asia, North America and Europe. The company states an IP portfolio of more than 448 internationally granted patents.
Products
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Catalogues & brochures
Factory & locations
ACM Research, Inc.
Wafer fabrication equipment for IC, compound semiconductor and advanced packaging.
Overview
ACM Research, Inc. It develops, manufactures and sells production equipment and provides service solutions for single-wafer and batch wet cleaning, electroplating, stress-free polishing, PECVD, track and thermal processes.
The tools serve IC and compound semiconductor manufacturing, wafer-level packaging, panel-level packaging, and wafer manufacturing and reclaim, for wafer sizes up to 12 inches. Proprietary process technologies include SAPS and TEBO megasonic cleaning.
Product development, manufacturing and support are provided through subsidiaries in Shanghai, China and Korea. The sales and service organisation supports customers in Asia, North America and Europe. The company states an IP portfolio of more than 448 internationally granted patents.
- Founded
- 1998 (California)
- Headquarters
- Fremont, California, USA
- Wafer size supported
- Up to 12 inches
- Subsidiaries
- Shanghai (China) and Korea
- Patents
- More than 448 internationally granted (company statement)
- Offices
- USA, South Korea, Singapore, China
Products
Ultra C b backside cleaning systemSingle-waferBackside cleaning
Ultra C SAPS cleaning systemSAPS megasonicSingle-wafer
Ultra C TEBO cleaning systemTEBO megasonic
Ultra C Tahoe SPM cleaning systemSPM clean
Ultra C s scrubber systemScrubber
Ultra C ct coater and Ultra C dv developer systemsCoaterDeveloper
Ultra C we wet etching and Ultra C pr wet stripping systemsWet etchResist strip
Ultra C wb wet benchBatchWet bench
Ultra C vac-p flux cleaning tool and Ultra C bev-p bevel etch tool (panel)Panel-levelFlux cleaning
Ultra SFP stress-free polishing systemStress-free polishing
Documents
Contact
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Factory
- ACM Research Shanghai
- ACM Research Korea