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Wuhan DR Laser Technology Co., Ltd.

Laser application equipment for solar cells, advanced displays and semiconductors

Wuhan, HubeiElectronics · Semiconductors
Wuhan DR Laser Technology Co., Ltd.

Overview

It applies laser processing to PERC, MWT, TOPCon and other high-efficiency solar cell and module technologies. It states that its PERC laser ablation and SE laser doping equipment has been sold to Japan, South Korea, Australia, Singapore, Taiwan, Malaysia, Thailand, Vietnam, India, Turkey and other markets.

The company has its headquarters in Wuhan, a global R&D center in Tel Aviv, Israel, a global R&D center in Singapore, and an R&D and production base in Wuxi. Its product range is grouped into Photovoltaic, Advanced Display and Semiconductor lines.

DR Laser plans to extend its range beyond solar cells into consumer electronics and integrated circuits. Its semiconductor line already includes IGBT laser annealing, laser wafer cutting and TGV laser micro-drilling systems.

Laser equipment for PERC, TOPCon, HJT, perovskite and other solar cell processes
Semiconductor line: laser wafer cutting, IGBT laser annealing, TGV micro-drilling
Advanced display line: MicroLED laser transfer, OLED array repair, Mini/Micro LED laser soldering
R&D centers in Tel Aviv (Israel) and Singapore, plus an R&D and production base in Wuxi
Listed on the GEM Board of the Shenzhen Stock Exchange (stock code 300776)
Customised laser solutions built to customer process needs

Products

10 listed

Videos

Catalogues & brochures

Factory & locations

Wuhan headquartersChina
Wuxi R&D and production baseChina
R&D and production

Wuhan DR Laser Technology Co., Ltd.

Laser application equipment for solar cells, advanced displays and semiconductors

Wuhan, Hubei

Overview

It applies laser processing to PERC, MWT, TOPCon and other high-efficiency solar cell and module technologies. It states that its PERC laser ablation and SE laser doping equipment has been sold to Japan, South Korea, Australia, Singapore, Taiwan, Malaysia, Thailand, Vietnam, India, Turkey and other markets.

The company has its headquarters in Wuhan, a global R&D center in Tel Aviv, Israel, a global R&D center in Singapore, and an R&D and production base in Wuxi. Its product range is grouped into Photovoltaic, Advanced Display and Semiconductor lines.

DR Laser plans to extend its range beyond solar cells into consumer electronics and integrated circuits. Its semiconductor line already includes IGBT laser annealing, laser wafer cutting and TGV laser micro-drilling systems.

Founded
2008
Headquarters
Wuhan, China
Stock listing
GEM Board, Shenzhen Stock Exchange (May 2019)
R&D centers
Tel Aviv (Israel), Singapore
R&D and production base
Wuxi, China

Products

  • Laser Wafer Cutting System
  • IGBT Laser Annealing System
  • Wafer Level TGV Laser Micro-Drilling System
  • Panel Level TGV Laser Micro-Drilling System
  • MicroLED Laser Transfer System
  • Laser Ablation System15-50 µm line widthOnline / offline
  • Laser Doping SystemSquare spotOnline / offline
  • Laser Micro-Etching SystemUltrafast laserSquare beam spot
  • Pattern Transfer Printing (PTP)20-50% paste savingNon-contact
  • Laser Scribing System for Perovskite Solar CellsUp to 1600×1000 mm8-12 laser channels

Contact

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Factory

  • Wuhan headquarters
  • Wuxi R&D and production baseR&D and production

In Machinery & Suppliers